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Amaoe 0.15MM Full Set Reballing Stencil Plant: EMMC EMCP UFS BGA153-254 Tin Steel Net with Fixd Plate and Holder

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Product details

Description

Professional EMMC EMCP UFS Reballing Stencil Kit

This comprehensive kit is designed for reballing various EMMC, EMCP, and UFS font chip types and models, catering to different capacities and font thicknesses. The adjustable steel frame ensures convenient tin replacement and cost savings, eliminating the need for multiple stencils.

Key Features:

**Accurate IC Welding Positioning** with Fixd Plate and Holder for easy and precise use.

**Adjustable Steel Frame** for convenient tin replacement and cost savings.

**Package Includes:**

• 6 x Steel Net
• 1 x Fixed Plate
• 1 x Holder
• 2 x Adjustable Steel Frame
• 2 x Adjustable Steel Sheet

**Summary:** This professional reballing stencil kit is an essential tool for EMMC, EMCP, and UFS font chip types and models, offering adjustability, convenience, and cost savings.

aml5plarfunj2
aml5plarfunj
Amaoe 0.15MM Full Set EMMC EMCP UFS BGA153 BGA162 BGA169 BGA186 BGA221 BGA254 Reballing Stencil Plan
Amaoe 0.15MM Full Set EMMC EMCP UFS BGA153 BGA162 BGA169 BGA186 BGA221 BGA254 Reballing Stencil Plan
Amaoe 0.15MM Full Set EMMC EMCP UFS BGA153 BGA162 BGA169 BGA186 BGA221 BGA254 Reballing Stencil Plan
Amaoe 0.15MM Full Set EMMC EMCP UFS BGA153 BGA162 BGA169 BGA186 BGA221 BGA254 Reballing Stencil Plan
Amaoe 0.15MM Full Set EMMC EMCP UFS BGA153 BGA162 BGA169 BGA186 BGA221 BGA254 Reballing Stencil Plan
Amaoe 0.15MM Full Set EMMC EMCP UFS BGA153 BGA162 BGA169 BGA186 BGA221 BGA254 Reballing Stencil Plan
Amaoe 0.15MM Full Set EMMC EMCP UFS BGA153 BGA162 BGA169 BGA186 BGA221 BGA254 Reballing Stencil Plan
Amaoe 0.15MM Full Set EMMC EMCP UFS BGA153 BGA162 BGA169 BGA186 BGA221 BGA254 Reballing Stencil Plan
Amaoe 0.15MM Full Set EMMC EMCP UFS BGA153 BGA162 BGA169 BGA186 BGA221 BGA254 Reballing Stencil Plan

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