2uFix Degumming Repairing Bent Blade Set for Mobile Phone Screen Debonding Removal IC Repair
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Product details
Description
2uFix Degumming Repairing Bent Blade Set for Mobile Phone Screen Debonding/Removal IC
Product Overview
This degumming repairing bent blade set is designed for mobile phone screen debonding/removal IC and is ideal for professionals and DIY enthusiasts. The set comes with 7 high-quality blades and a compact storage box, making it easy to use and store.
Key Features
- Compact Storage Box: Independent pull-out stainless steel storage box, exquisite and compact, easy to store, and easy to use.
- Patented Trimming Technology: Double-sided uniform trimming, utility model patented technology for efficient debonding.
- Uniform Force Distribution: The blade is from thin to thick, and the force is more uniform, reducing the risk of damage to the motherboard or screen.
- Versatile Applications: Suitable for removing glue from the screen, and removing the CPU, screen IC, mobile phone motherboard, small parts such as separators, chips, etc.
- Bent-Blade Design: Upgraded to a more practical bent-blade design, reducing the loss to the motherboard, chip, screen, etc. and improving the yield.
- Anti-Rust Coating: Nano-coating is anti-rust, the blade body is flexible, thin, and elastic, with a blade tip thickness of 0.06mm and a blade tail thickness of about 0.3mm.
What's Included
- 7 x Blades
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