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Amaoe 0.10mm Middle Layer BGA Reballing Stencil Platform Set for ASUS ROG8 Qualcomm Version

amaoe 010mm-middle-layer-bga-reballing-stencil-platform-set-for-asus-rog8-qualcomm-version-1

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Description

Amaoe 0.10mm Middle Layer BGA Reballing Stencil Platform Set for ASUS ROG8 Qualcomm Version

Package includes:
  • 2 x Tin scraping blade
  • 1 x Positioning plate
  • 1 x Magnetic base
  • 1 x Stencil
amaoe 010mm-middle-layer-bga-reballing-stencil-platform-set-for-asus-rog8-qualcomm-version-1
amaoe 010mm-middle-layer-bga-reballing-stencil-platform-set-for-asus-rog8-qualcomm-version-2
amaoe 010mm-middle-layer-bga-reballing-stencil-platform-set-for-asus-rog8-qualcomm-version-3
amaoe 010mm-middle-layer-bga-reballing-stencil-platform-set-for-asus-rog8-qualcomm-version-4

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