Amaoe 0.12mm BGA Reballing Stencil for Qualcomm SM8350 Snapdragon 888 Lower Layer
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Seller: Worldswa Shenzhen
ID: MV-220530MLSPLE
Weight: 0.01 kg
| Qty | Price | Discount |
|---|---|---|
| 1 | NaN | |
| 3 | NaN | -2.9% |
| 5 | NaN | -5.0% |
| 10 | NaN | -8.6% |
Product details
Description
Amaoe 0.12mm BGA Reballing Stencil for Qualcomm SM8350 Snapdragon 888 Lower Layer
Package includes:
- 1 x Stencil
Customer reviews
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