Amaoe Carve Through Edition 0.12mm BGA Reballing Stencil for Apple A15 CPU Bottom Layer
0 out of 5 stars
No review yet| Qty | Price | Discount |
|---|---|---|
| 1 | NaN | |
| 3 | NaN | -2.9% |
| 5 | NaN | -5.0% |
| 10 | NaN | -8.6% |
Product details
Description
Amaoe 0.12mm Bottom Layer BGA Reballing Stencil for Apple A15 CPU - Carve Through Edition
**Alternative Option:** If you need a Half-engraved version of this tin planting steel mesh, please Click Here
What's in the Box:
- 1 x Stencil
Features:**
- **Summary:** High-quality 0.12mm BGA reballing stencil for Apple A15 CPU bottom layer
Customer reviews
0.0/ 5.0
0
0
0
0
0
