Amaoe Carve Through Edition 0.12mm BGA Reballing Stencil for Apple A15 CPU Bottom Layer
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Seller: Worldswa Shenzhen
ID: MV-2207068C6R3W
Weight: 0.01 kg
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| 3 | NaN | -2.9% |
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Product details
Description
Amaoe 0.12mm Bottom Layer BGA Reballing Stencil for Apple A15 CPU - Carve Through Edition
**Alternative Option:** If you need a Half-engraved version of this tin planting steel mesh, please Click Here
What's in the Box:
- 1 x Stencil
Features:**
- **Summary:** High-quality 0.12mm BGA reballing stencil for Apple A15 CPU bottom layer
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