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Amaoe 0.12mm Lower Layer (CPU) BGA Reballing Stencil Platform Set for Apple A18 / iPhone 16 / 16 Plus

amaoe 012mm-lower-layer-cpu-bga-reballing-stencil-platform-set-for-apple-a18-iphone-16-16-plus-1

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Description

Amaoe 0.12mm Lower Layer (CPU) BGA Reballing Stencil Platform Set for Apple A18 / iPhone 16 / 16 Plus

Package includes:
  • 2 x Tin Scraping Blade
  • 1 x Positioning Plate
  • 1 x Magnetic Base
  • 1 x Stencil
amaoe 012mm-lower-layer-cpu-bga-reballing-stencil-platform-set-for-apple-a18-iphone-16-16-plus-1
amaoe 012mm-lower-layer-cpu-bga-reballing-stencil-platform-set-for-apple-a18-iphone-16-16-plus-4
amaoe 012mm-lower-layer-cpu-bga-reballing-stencil-platform-set-for-apple-a18-iphone-16-16-plus-3
amaoe 012mm-lower-layer-cpu-bga-reballing-stencil-platform-set-for-apple-a18-iphone-16-16-plus-5
amaoe 012mm-lower-layer-cpu-bga-reballing-stencil-platform-set-for-apple-a18-iphone-16-16-plus-2

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