Amaoe 0.12mm Lower Layer (CPU) BGA Reballing Stencil Platform Set for Apple A18 Pro / iPhone 16P / 16PM
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Seller: Worldswa Shenzhen
ID: MV-24101158X61W
Weight: 0.35 kg
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| 1 | NaN | |
| 3 | NaN | -3.0% |
| 5 | NaN | -5.2% |
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Description
Amaoe 0.12mm Lower Layer (CPU) BGA Reballing Stencil Platform Set for Apple A18 Pro / iPhone 16P / 16PM
Package includes:
- 2 x Tin Scraping Blade
- 1 x Positioning Plate
- 1 x Magnetic Base
- 1 x Stencil
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