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Amaoe Huawei P40 Pro 0.12mm Motherboard Mid-Frame BGA Reballing Stencil Platform for Middle Layer

Amaoe 0.12mm Motherboard Mid-Frame BGA Reballing Stencil Platform for Huawei P40 Pro Middle Layer

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Product details

Description

Amaoe 0.12mm Motherboard Mid-Frame BGA Reballing Stencil Platform for Huawei P40 Pro Middle Layer


Features:

  • 4 in 1 middle layer tin planting/innovative single-sided
    **Precise and efficient tin planting process**
  • Precise positioning, fast tin planting
  • Strong magnetic adsorption, precision hole pitch design
  • Imported steel, round and square precise holes, make the tin balls more rounded and prevent the mesh from getting stuck in the tin balls
  • Built-in high-temperature magnet, strong magnetic adsorption, precise positioning, no deviation, high-temperature magnetism unchanged


Package Includes:

  • 1 x Fixture
  • 1 x Base
  • 1 x Steel mesh
  • 2 x Blade


Amaoe 0.12mm Motherboard Mid-Frame BGA Reballing Stencil Platform for Huawei P40 Pro Middle Layer
Amaoe 0.12mm Motherboard Mid-Frame BGA Reballing Stencil Platform for Huawei P40 Pro Middle Layer
Amaoe 0.12mm Motherboard Mid-Frame BGA Reballing Stencil Platform for Huawei P40 Pro Middle Layer
Amaoe 0.12mm Motherboard Mid-Frame BGA Reballing Stencil Platform for Huawei P40 Pro Middle Layer
Amaoe 0.12mm Motherboard Mid-Frame BGA Reballing Stencil Platform for Huawei P40 Pro Middle Layer

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