Amaoe Huawei P40Pro+ 0.12mm Motherboard Mid-Frame BGA Reballing Stencil Platform for Middle Layer
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Product details
Description
Amaoe 0.12mm Motherboard Mid-Frame BGA Reballing Stencil Platform for Huawei P40 Pro+ Middle Layer
Product Features:
- 4 in 1 middle layer tin planting, innovative single-sided design for efficient reballing process
- Precise positioning, fast tin planting for accurate results
- Strong magnetic adsorption, precision hole pitch design for secure holding
- High-quality imported steel, with round and square precise holes to prevent tin balls from getting stuck
- Built-in high-temperature magnet, strong magnetic adsorption, precise positioning, and no deviation, even at high temperatures
**Summary: Innovative BGA reballing stencil platform with precise positioning and strong magnetic adsorption for efficient and accurate results.**
Package Includes:
- 1 x Fixture
- 1 x Base
- 1 x Steel mesh
- 2 x Blade
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