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Amaoe 0.12mm Motherboard Middle Layer BGA Reballing Stencil Platform Set for Huawei Pocket 2

amaoe 012mm-motherboard-middle-layer-bga-reballing-stencil-platform-set-for-huawei-pocket-2-5

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Description

Amaoe 0.12mm Motherboard Middle Layer BGA Reballing Stencil Platform Set for Huawei Pocket 2

Package includes:
  • 2 x Tin scraping blade
  • 1 x Positioning plate
  • 1 x Magnetic base
  • 1 x Stencil
amaoe 012mm-motherboard-middle-layer-bga-reballing-stencil-platform-set-for-huawei-pocket-2-5
amaoe 012mm-motherboard-middle-layer-bga-reballing-stencil-platform-set-for-huawei-pocket-2-3
amaoe 012mm-motherboard-middle-layer-bga-reballing-stencil-platform-set-for-huawei-pocket-2-2
amaoe 012mm-motherboard-middle-layer-bga-reballing-stencil-platform-set-for-huawei-pocket-2-4
amaoe 012mm-motherboard-middle-layer-bga-reballing-stencil-platform-set-for-huawei-pocket-2-1

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