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Amaoe 4-in 1 0.15mm Phone EMMC / EMCP / UFS Reballing Platform with BGA153 BGA162 BGA221 BGA254 Reballing Stencil

Amaoe 4-in 1 0.15mm Phone EMMC / EMCP / UFS Reballing Platform with BGA153 BGA162 BGA221 BGA254 Reba

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ID: MV-211206158T8M
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Product details

Description

Amaoe 4-in 1 0.15mm Phone EMMC/EMCP/UFS Reballing Platform with BGA153 BGA162 BGA221 BGA254 Reballing Stencil

Package includes:
  • 1 x EMMC/EMCP/UFS Positioning plate
  • 1 x Base
  • 1 x Mbga-MY1 0.15MM Steel mesh
  • 2 x Blade
  • 3 x Adjustment piece
Amaoe 4-in 1 0.15mm Phone EMMC / EMCP / UFS Reballing Platform with BGA153 BGA162 BGA221 BGA254 Reba
Amaoe 4-in 1 0.15mm Phone EMMC / EMCP / UFS Reballing Platform with BGA153 BGA162 BGA221 BGA254 Reba
Amaoe 4-in 1 0.15mm Phone EMMC / EMCP / UFS Reballing Platform with BGA153 BGA162 BGA221 BGA254 Reba
Amaoe 4-in 1 0.15mm Phone EMMC / EMCP / UFS Reballing Platform with BGA153 BGA162 BGA221 BGA254 Reba

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