Amaoe MFix-14 Series: iPhone 14 Series Mbga Motherboard Middle Layer BGA Reballing Platform

Amaoe MFix-14 Series Mbga Motherboard Middle Layer BGA Reballing Platform for iPhone 14 Series

Product Overview

This Amaoe MFix-14 Series Mbga Motherboard Middle Layer BGA Reballing Platform is designed for iPhone 14 Series motherboard fixing and repair. It's a must-have tool for professional repair shops and individuals who want to fix and repair iPhone 14 Series motherboards efficiently.

Key Features:

• Motherboard fixing and repair, middle layer tin planting, CPU and hard disk fixing and removing glue (Effortless Repair)

• For different motherboard structures, multi-dimensional alr avoidance eliminates the need to remove the adhesive and the fixing sheet to improve work efficiency (Time-Saving Design)

• Height difference synthetic stone positioning clip to prevent pressure damage to copper sheets/cables (Protective Design)

• Modular design, split structure, each fixture can be operated independently for glue removal, which is more efficient to use (Modular Efficiency)

• Ergonomic design for easy opening and closing of components and clamping of the motherboard (Ergonomic Design)

• The positioning pin is inserted into the positioning hole, and the magnet is attached to the bottom screw, which can be quickly and easily fixed (Easy Fixation)

What's in the Box:

• 2 x Tin scraping blade

• 1 x Gaskets

• 2 x Fixture

• 1 x Magnetic base

• 2 x Stencil