Amaoe MFix-15 Series: Motherboard Middle Layer BGA Reballing Platform for iPhone 15 Series Mbga
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Product details
Description
Amaoe MFix-15 Series Mbga Motherboard Middle Layer BGA Reballing Platform for iPhone 15 Series
Product Overview
This Amaoe MFix-15 Series motherboard middle layer BGA reballing platform is designed for iPhone 15 series repair and maintenance. It offers a comprehensive solution for motherboard fixing, middle layer tin planting, CPU and hard disk fixing, and removing glue.
Key Features
- Motherboard Repair Made Easy: Fix and repair motherboards, plant tin in the middle layer, fix and remove CPU and hard disk glue.
- Efficient and Safe**: Multi-dimensional aluminum foil avoidance eliminates the need to remove adhesive and fixing sheets, improving work efficiency and preventing damage.
- Protective Design**: Height difference synthetic stone positioning clip prevents pressure damage to copper sheets and cables.
- Modular and Ergonomic**: Modular design with split structure allows each fixture to operate independently for glue removal, making it more efficient to use. Ergonomic design enables easy opening and closing of components and clamping of the motherboard.
- Quick and Easy Fixing**: Positioning pin inserts into the positioning hole, and the magnet attaches to the bottom screw, allowing for quick and easy fixing.
What's in the Box
- 2 x Tin Scraping Blades
- 1 x Gaskets
- 2 x Fixtures
- 1 x Magnetic Base
- 2 x Stencils
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