Amaoe SM8450 BGA Reballing Stencil (0.12mm) for Snapdragon 8 Gen 1 CPU (Upper and Lower Layer)
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Product details
Description
Amaoe SM8450 0.12mm BGA Reballing Stencil for Snapdragon 8 Gen 1/SM8450 CPU Upper and Lower Layer
Product Overview
This BGA reballing stencil is specifically designed for Snapdragon 8 Gen 1/SM8450 CPU, providing a precise and reliable solution for reballing and repairing.
Package Includes:
- 1 x Steel Mesh (0.12mm thickness for precise reballing)
Key Features:
- **Accurate Reballing**: 0.12mm thickness ensures precise reballing and minimizes errors.
- **Compatibility**: Designed specifically for Snapdragon 8 Gen 1/SM8450 CPU upper and lower layer.
- **Durable Material**: Made from high-quality steel mesh for long-lasting performance.
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