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Amaoe U16 0.12mm BGA Reballing Tin Planting Positioning Platform for Qualcomm Snapdragon 888 / SM8350

Amaoe U16 0.12mm BGA Reballing Tin Planting Positioning Platform for Qualcomm Snapdragon 888 / SM835

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Product details

Description

Amaoe U16 0.12mm BGA Reballing Tin Planting Positioning Platform for Qualcomm Snapdragon 888/SM8350

Package includes:
  • 1 x Positioning plate
  • 1 x Magnet Base
  • 1 x Steel mesh
  • 2 x Blade
Amaoe U16 0.12mm BGA Reballing Tin Planting Positioning Platform for Qualcomm Snapdragon 888 / SM835
Amaoe U16 0.12mm BGA Reballing Tin Planting Positioning Platform for Qualcomm Snapdragon 888 / SM835
Amaoe U16 0.12mm BGA Reballing Tin Planting Positioning Platform for Qualcomm Snapdragon 888 / SM835
Amaoe U16 0.12mm BGA Reballing Tin Planting Positioning Platform for Qualcomm Snapdragon 888 / SM835
Amaoe U16 0.12mm BGA Reballing Tin Planting Positioning Platform for Qualcomm Snapdragon 888 / SM835
Amaoe U16 0.12mm BGA Reballing Tin Planting Positioning Platform for Qualcomm Snapdragon 888 / SM835

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