Amaoe U3 BGA CPU Stencil IC Solder Reballing Tin Net for Hi6250, MSM8916, MSM8939, MSM8937, MSM8917, MSM8940, MSM8953-B01, MSM8952 with Plate and Magnetic Base Holder
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Product details
Description
Amaoe U3 BGA CPU Stencil IC Solder Reballing Tin Net for Hi6250 MSM8916 MSM8939 MSM8937 MSM8917 MSM8940 MSM8953-B01 MSM8952 with Plate and Magnetic Base Holder
Product Overview
This comprehensive kit is designed for BGA CPU stencil IC solder reballing and tin net applications, specifically compatible with Hi6250 MSM8916 MSM8939 MSM8937 MSM8917 MSM8940 MSM8953-B01 MSM8952 models.
Package Includes:
- 1 x Magnet Base for secure holding of the stencil
- 1 x Positioning Plate for precise alignment
- 5 x Stencil for multiple uses
- 8 x IC Spacers for added convenience
- 2 x Tin Scraping Blade for efficient tin removal
Key Features:
- Comprehensive Kit: Includes everything you need for BGA CPU stencil IC solder reballing and tin net applications
- Wide Compatibility: Supports Hi6250 MSM8916 MSM8939 MSM8937 MSM8917 MSM8940 MSM8953-B01 MSM8952 models
- High-Quality Materials: Durable and long-lasting materials ensure optimal performance
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