Amtech RMA-223-UV 100g BGA Solder Flux Paste - SMT Reballing & Tin Planting
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Product details
Description
Amtech RMA-223-UV 100g BGA Solder Flux Paste for SMT Reballing Tin Planting
Product Overview
This Amtech RMA-223-UV 100g BGA Solder Flux Paste is suitable for SMT reballing, tin planting, and mobile phone PCB. It's an ideal choice for PGA rework solder paste.
Features:
- **Fast Soldering Speed**: Low ionic activator system for quick soldering and low smoke generation.
- **High Insulation Resistance**: The surface insulation resistance of the residue after curing is very high.
- **Multi-Application**: Suitable for mobile phone PCB, SMD rework solder paste, and PGA.
Package Includes:
- 1 x Flux
Important Notice:
Due to FedEx and DHL shipping restrictions, this product can only be shipped by Singapore Post - Standard Mail or Registered Mail. If your order includes other products, we will separate this item and ship it via Singapore Post, while the other products will be shipped via the courier of your choice. Thank you for your understanding.
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