BEST Soldering Lugs Pad for IC BGA PCB Rework and Phone Repair Welding

BEST Soldering Lugs Pad for Phones IC BGA PCB Rework Welding Repair

Features:

• Replace the traditional circling of jump wire to fill the missing solder joint, restore it to the original pad, and without a trace
• The pads are reinforced with fixed pins and will never fall off
• It adopts industrial-grade printed circuit board copper foil with a thickness of 30μm
• Good flatness, which can prevent pseudo soldering effectively caused by unevenness
• The connection joint with the circuit is firm and can fix the green oil(UV curing solder mask ink)well
• It saves time and effort and no need to circle during jumping wire so the repair efficiency is relatively high
• The BGA bonding surface has saturation, stable electrical performance, and good welding strength, and it is not easy to drop off and unsoldering.
• Applicable for dot-faded soldering pad with various shapes and models of soldering lug
• Summary:** Efficient repair solution with high welding strength and stable electrical performance.

Specification:

• Name: Solder points pad
• Brand: BEST
• Material: Red copper
• Product specifications: 208 points/sheet
• Product Size: 28*28mm
• Package dimensions: 60*98mm
• Net weight: 0.2g
• Gross weight: 1.8g
• Instructions for use: No need to make a circle, the fly line directly makes up points

Package includes:

• 1 x Soldering Lugs(Random Color)