BST-084 3-in-1 Motherboard BGA Reballing Platform for iPhone 14 Full Series Middle Layer
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Product details
Description
BST-084 3-in-1 Middle Layer Motherboard BGA Reballing Platform for iPhone 14 Full Series
Overview
This 3-in-1 magnetic flocking platform is designed for iPhone 14, 14 Plus, 14 Pro, and 14 Pro Max middle layer BGA reballing stencil.
Features:
- Accurate Stencil Design: The rounded square and precise hole position make the tin ball more rounded and prevents the mesh from jamming the tin ball.
- Strong Magnetic Adsorption: There is a strong magnet embedded in the base, ensuring accurate positioning, no deviation, and consistent magnetism even at high temperatures.
- Durable Steel Stencil: The steel stencil has strong toughness, high-temperature resistance, and is not easily deformed, making it easy to remove and preventing tin blocks from forming.
- High-Quality Tin Balls: Every tin ball is as round and full as a pearl, meeting the chip requirements.
Package Includes:
- 1 x BGA Reballing Platform
Summary: This 3-in-1 middle layer motherboard BGA reballing platform is designed for iPhone 14 series, featuring a precise stencil design, strong magnetic adsorption, durable steel stencil, and high-quality tin balls, making it an ideal tool for BGA reballing.
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