DS-201B Tin Planting Platform: Supports PMU, SMC, T1, T2, RAM, and NAND Wifi Power Chips
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Product details
Description
DS-201B Tin Planting Platform for PMU/SMC/T1/T2/RAM/NAND Wifi Power Chips
Product Overview
This DS-201B tin planting platform is specifically designed for ball planting of small BGA chips, including PMU, SMC, T1, T2, RAM, NAND, and WiFi power chips.
Features:
This comprehensive kit includes:
- Mainly used for ball planting of small BGA chips (including PMU, SMC, T1, T2, RAM, NAND, and WiFi power chip)
- **Complete Kit for Efficient Ball Planting**: Including 16pcs steel mesh, 15pcs steel mesh fixing base, 2pcs magnetic base, 9pcs steel sheet, and 1pcs tin knife
Package Includes:
- 2 x Magnetic base
- 16 x Steel mesh
- 9 x Steel sheet
- 1 x Tin knife
Kit Summary:
Everything you need for efficient ball planting of small BGA chips in one convenient kit.
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