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BGA100 eMMC100 Aging Burn-in Test Socket with USB Interface for BGA100 to USB

emmc100 aging-burn-in-test-socket-with-usb-interface-for-bga100-to-usb-1

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12 x 18mm14 x 18mm

Product details

Description

eMMC100 Aging Burn-in Test Socket with USB Interface for BGA100 to USB


Product Overview

This eMMC100 Aging Burn-in Test Socket is designed for programming, testing, reading, and writing to eMMC100 IC chips. It features an ITE IT1327 main control chip, built-in SD/MMC card power supply, and a high-speed USB 2.0 interface.


Key Features:

  • **Main Control Chip:** ITE IT1327 with built-in SD/MMC card power supply and integrated 5V to 3.3V voltage regulator
  • **High-Speed Interface:** USB 2.0 interface, backward compatible with USB 1.1
  • **Integrated Transceiver:** UTMI and SIE for efficient data transfer
  • **Power Mode:** Supports bus power mode
  • **Hot-Plugging:** Supports hot-plugging and individual switching of the power supply
  • **Floating Board Structure:** Precise positioning, easy access to ICs, and higher efficiency
  • **Compatibility:** Applies to eMMC of Samsung, Sandisk, Toshiba, Hynix, and Intel
  • **Socket Specifications:** 88pins, pin pitch 1.0mm, eMMC size 12x18mm (also available in 14x18mm)
  • **eMMC Thickness:** Supports eMMC thickness of 0.6mm to 2.0mm
  • **Testing Options:** Test can be carried out with or without balls
  • **BGA Compatibility:** Applies to BGA 100
  • **Easy Operation:** Easy operation by inserting USB into your PC directly


What's in the Box:

  • 1 x Test Socket
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