eMMC100 Aging Burn-in Test Socket for BGA100 to USB (No Adaptor Plate)

eMMC100 Aging Burn-in Test Socket without Adaptor Plate for BGA100 to USB

Overview

This eMMC100 Aging Burn-in Test Socket is designed for programming, testing, reading, and writing to EMMC100 IC chips. It supports hot-plugging and individual switching of the power supply, and can be connected via USB or by connecting a cable to the corresponding PIN on the board.

Features:

• **Precise Positioning and Easy Access**: Floating board structure for precise positioning, easy access to ICs, and higher efficiency.
• Supports hot-plugging and individual switching of the power supply, supports testing via the USB interface or by connecting a cable to the corresponding PIN on the board.
• **Compatible with Multiple Brands**: Apply to eMMC of Samsung, Sandis k, Toshiba, Hynix, and Intel.
• **Flexible Pin Configuration**: With 88pins and pin pitch 1.0mm, eMMC size 12x18mm, we also provide another type of size 14x18mm.
• **Wide Thickness Range**: Apply to eMMC thickness of 0.6mm to 2.0mm.
• The test can be carried out with or without balls.
• This product applies to BGA 100.

Package Includes:

• 1 x Test Socket (without Adaptor Plate)