FindX Large Size Heat-resistant Magnetic Silicone Mat for BGA Soldering Mobile Phone Repair
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Description
FindX Large Size Heat-resistant Magnetic Silicone Mat for Mobile Phone BGA Soldering Repair
Product Overview
This large size heat-resistant magnetic silicone mat is designed for mobile phone BGA soldering repair. It provides a spacious working area and features a unique magnetic design for convenient tool placement and storage.
Key Features
- Large Working Area: 495*345 mm, providing ample space for your repair tasks.
- Maintenance-specific Design: Thermal insulation pad, storage parts, screw classification, and storage slot for organized repair.
- High-temperature Resistance: Up to 500 ℃, ensuring safe and reliable use.
- Magnetic Storage Element Grid: Fix the motherboard securely and prevent losing parts.
- Foldable and Deformation-resistant: Soft silicone material, easy to roll and fold, and strong recovery.
- Corrosion-resistant: Durable and long-lasting, with high-temperature resistance up to 500°C.
- Magnetic Screw Storage and Adsorption Grid: Easy tool placement and non-slip to prevent parts from falling.
**Summary:** Large size, heat-resistant, magnetic silicone mat for mobile phone BGA soldering repair with organized storage and convenient tool placement.
What's in the Box
- 1 x Silicone Mat
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