iPhone X High Quality Multi-Function BGA Reballing Positioning Fixture Motherboard Cooling Soldering Desoldering Platform
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Product details
Description
**Professional iPhone Motherboard Fixing Solution**
Introducing the High-Quality Multi-Function BGA Reballing Positioning Fixture Motherboard Cooling Soldering Desoldering Platform for iPhone X
This premium fixture is designed for professional iPhone motherboard repair, offering a comprehensive solution for CPU NAND chips positioning, disassembly, soldering, and more. The cooling high-temperature resistant feature provides the best assistance for fixing iPhone motherboards.
Key Features:
Heat Conduction System: Pure copper heat conduction block prevents tin-burst on the back IC of the cell phone motherboard, ensuring IC safety.
CPU Positioning Structure: No manual positioning needed, improving the success rate.
Integrated Layer Tin Planting Function: Precision stencils produced by world's leading laser technology.
Motherboard Layer Separation and Positioning Installation Structure: Efficient repairs for separating, soldering, and installation.
Precision Positioning Column: Ensures efficient repairs for separating, soldering, and installation.
Durable Materials: Pure copper heat conduction material with special processing to maintain a new surface color.
Imported Synthetic Stone Materials: Tested and improved precision processing with 500-degree high-temperature direct heating, ensuring durability and no deformation.
**Summary:** This fixture offers a comprehensive solution for iPhone motherboard repair, featuring a heat conduction system, CPU positioning structure, integrated layer tin planting function, and more.
Package Includes:
1 x Working Platform
1 x CPU Positioning Solder Net
1 x Positioning Mold Steel Plate
1 x Mainboard Protector
1 x NAND BGA Reballing Net
2 x Heat Sink
