i2C 1.5M Low Residue Solder Wick for Mobile Phone PCB Board Repair (10Pcs)
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Description
i2C 1.5M Low Residue Solder Wick for Mobile Phone PCB Board Repair - 10Pcs
Product Description:
This i2C solder wick is designed for mobile phone PCB board repair, offering strong clean performance with low residue, fast tin application, and excellent tin absorption.
Key Features:
- **Low Residue and Fast Tin Application**: Strong clean original solder wick with low residual, suitable for precision device clean use.
- **Environmental Protection and Health**: Made with pure copper braid, this solder wick is environmentally friendly and prioritizes your health.
- **Fast Heat Conduction and Soft Design**: The solder wick uses a flat needle to braid, ensuring soft design, fast heat conduction, and promoting work efficiency.
- **Multiple Standards of Wire Diameters**: Available in 7 standard sizes: 1015/1515/2015/2515/3015/3515/4015, dedicated for fast absorb tin and low residual on PCB electronic circuit boards.
- **Scientific Formula and Eco-Friendly Production**: Refined with a scientific formula, this solder wick is produced using an environmental protection chemical method that puts your health first.
Package Includes:
- 10 x Solder Wick
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