i2C FA02 Face Repair Integrated Dot Matrix Chip: iPhone X-12Pro Max / iPad Pro 3 / 4 Compatible

i2C FA02 Face Repair Integrated Dot Matrix Chip Supports iPhone X-12Pro Max/iPad Pro 3/4

Features:

• No need to convert the gasket and capacitor, no need to MOS tube, with A1 foot, with the tin ball, automatic welding return
• Original thickness, no trace of repair, and stability without repair again
• No need to transfer gasket and capacitor, direct welding, simple operation
• No MOS tube, which reduce the difficulty of maintenance, newbie can also operate
• Original thickness, no trace of repair, stability without repair again with A1 foot, with the tin ball, automatic welding return, It can be operated without a microscope
• Generally X-12PM, iPad, and other models, strong versatility
• The second generation of procedures can be brushed, can be restored, do not lose data, more stability

**Summary:** Easy to use, no need to convert gasket and capacitor, original thickness, and stability without repair again

Operating Tutorial (Support i6/i6S/dot matrix repair device-V8i):

• Click the "Cloud Backup" screen
• Buckle the original face module on the board, and automatically read the dot matrix data
• Click "Upload Data", after uploading, click "OK", the data has been backed up
• The dialog box will display a message indicating that the backup succeeded
• The backup is complete
• Remove the chip from the original board
• Weld FA02 integrated chip to the small plate
• After welding, tie the cable to the device for testing and burning data that has been backed up
• Remove the welded line, buckle it on the dot matrix board and click"Test", check whether the data is normal, and then click "Burn", after burning, carrying out installation tests

Package Includes:

• 1 x Chip