JTX SM-01 Swap Board Chips BGA Reballing Stencil Platform Set - for iPhone 8 to 15 Pro Max
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Product details
Description
JTX SM-01 Swap Board Chips BGA Reballing Stencil Platform Set for iPhone 8 to 14Pro Max
Product Overview
This JTX SM-01 Swap Board Chips BGA Reballing Stencil Platform Set is a professional tool designed for iPhone 8 to 14Pro Max motherboard repair. It features a super magnetic positioning reballing platform, high-temperature resistant ultra-thin positioning plate, and strong magnetic base for accurate and efficient chip reballing.
Key Features:
- Super Magnetic Positioning: High temperature resistant ultra-thin positioning plate, strong absorption of tin mesh.
- Universal Compatibility: Supports iPhone 8 to 15Pro Max, and future motherboard soldering upgrades.
- Accurate Positioning: Strong magnetic base, automatic alignment, and firm clamping for efficient work.
- Durable Design: Synthetic stone design with high-temperature resistance, high strength, and easy cleaning.
- Rapid Positioning: Board swapping chips rapid positioning integrated processing for faster and safer repair.
- High-Quality Materials: Selected high-quality steel with fine workmanship, wear resistance, and high toughness support tin planting.
- Effective Mesh Design: Square chamfered mesh design prevents steel mesh bulge and ensures tin balls are more round and full.
- Environmentally Friendly: Plant tin table made of eco-friendly rubber foot mat with wear-resistant, anti-slip, shock-absorbing, and anti-pressure properties.
Package Includes:
- 1 x Base
- 9 x Positioner Plate
Summary:
This JTX SM-01 Swap Board Chips BGA Reballing Stencil Platform Set is a must-have tool for professional iPhone motherboard repair. It offers a range of innovative features, durable design, and high-quality materials, making it an excellent choice for efficient and safe chip reballing.
