JTX T4 Universal Platform Set: Chips Glue Removal & Tin Planting for iPhone / Samsung / Hisilicon / Android RAM

JTX T4 Universal Chips Glue Removal and Tin Planting Platform Set for iPhone / Samsung / Hisilicon / Android RAM

Overview

This 2-in-1 degumming and tin planting platform supports 76 models of chips from Apple, Huawei, OPPO, vivo, Honor, Xiaomi, Samsung, and more.

Key Features:

• Universal Compatibility: Supports 76 models of chips from various brands, including Apple, Huawei, Samsung, and more.
• 2-in-1 Design: Combines degumming and tin planting functions, saving costs and increasing efficiency.
• Magnetic Automatic Clamping: Features a universal 3D planting tin net, precise positioning, and clamping precision for stable operation.
• Wear-Resistant and Durable: Made with high-quality steel, fine workmanship, and wear-resistant materials for high toughness and durability.
• Unlimited Expansion: Supports unlimited expansion for a wide range of chip models.
• High-Temperature Resistance: Resistant to high temperatures, wear, and aging, with a non-toxic and tasteless design.

Supported Models:

• Qualcomm: MSM8909/8905, MSM8916/8939, MSM8917, MSM8953, MSM8953 1AB, MSM8937/8940, MSM8996, SM8150, SM8250, SM8250-002, SM8350, SM8450, SM8475, SM8550, SM8650, SM6115, SM7225-00AB, SM7250, SM7325, SM7350, SDM439, SDM636, SDM710, SDM845
• Dimensity: MT6761V/6762V/6765V, MT6885Z, MT6895Z, MT6893Z, MT6855V, MT6853V, MT6877V, MT6769V, MT6873V, MT6833V, 1100/1200, 9200, 9300
• Android RAM: BGA 376, BGA 436, BGA 496, BGA 556
• Samsung Exynos: 990, 8895, 980, 2100, 2200, 9820
• Huawei Hisilicon: HI3660, HI9290/L, HI6280, HI3690 5G, HI3680, HI36A0, HI3670, HI36A0, HI6260, HI3690 4G
• Apple: A8, A9, A10, A11, A12, A13, A14, A15, A16, A17

Package Includes:

• 1 x Fixture
• 13 x Stencil