Kaisi iPhone 13 Series 4-in-1 Middle Layer Motherboard BGA Reballing Stencil Platform
0 out of 5 stars
No review yet| Qty | Price | Discount |
|---|---|---|
| 1 | NaN | |
| 3 | NaN | -2.4% |
| 5 | NaN | -4.8% |
| 10 | NaN | -7.1% |
Product details
Description
Kaisi 4-in-1 Middle Layer Motherboard BGA Reballing Stencil Platform for iPhone 13 Series
Features:
- Multiple Models: Suitable for iPhone 13/13Pro /13Pro Max /13Mini
- Stable and Safe: Silicone non-slip foot pads and a specific weighted iron plate at the bottom to effectively isolate the temperature, anti-skid, and anti-scald, ensuring the tin planting position is more stable.
- Precise Positioning: 4 in 1 Middle frame reballing platform with strong magnetic pressing, no bulge under high temperature, precise positioning for the motherboard in high precision for iPhone 13/13Pro /13Pro Max /13Mini
**Summary:** A 4-in-1 middle layer motherboard BGA reballing stencil platform designed for iPhone 13 series, providing stable and precise positioning for motherboard repair.
Package Includes:
- 1 x 4-in-1 Middle frame reballing platform
Customer reviews
0.0/ 5.0
0
0
0
0
0
