Kaisi iPhone 13 Series 4-in-1 Middle Layer Motherboard BGA Reballing Stencil Platform
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Seller: Worldswa Shenzhen
ID: MV-220505PUW29V
Weight: 0.40 kg
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| 3 | NaN | -2.4% |
| 5 | NaN | -4.8% |
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Product details
Description
Kaisi 4-in-1 Middle Layer Motherboard BGA Reballing Stencil Platform for iPhone 13 Series
Features:
- Multiple Models: Suitable for iPhone 13/13Pro /13Pro Max /13Mini
- Stable and Safe: Silicone non-slip foot pads and a specific weighted iron plate at the bottom to effectively isolate the temperature, anti-skid, and anti-scald, ensuring the tin planting position is more stable.
- Precise Positioning: 4 in 1 Middle frame reballing platform with strong magnetic pressing, no bulge under high temperature, precise positioning for the motherboard in high precision for iPhone 13/13Pro /13Pro Max /13Mini
**Summary:** A 4-in-1 middle layer motherboard BGA reballing stencil platform designed for iPhone 13 series, providing stable and precise positioning for motherboard repair.
Package Includes:
- 1 x 4-in-1 Middle frame reballing platform
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