iPhone A8 A9 Low Temperature Demolition Welding Platform
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Product details
Description
Temperature Setting Parameters
- Demolition shield temperature adjustment: 180 ℃ - 200 ℃
- In addition to the CPU side of the plastic temperature adjustment: 180 ℃ - 200 ℃
- Demolition of A8A9CPU temperature: 230 ℃ - 240 ℃
- Remove the glue temperature: 180 ℃ - 200 ℃
- Planting tin temperature adjustment: 180 ℃ - 200 ℃
- Welding A8A9CPU temperature: 190 ℃ - 210 ℃
Steps for Usage
**Easy 8-Step Process**
1. Turn on and adjust the temperature
2. Adjust the motherboard position and fix it
3. Preheat for 1 minute
4. Done preheat then disassemble the CPU
5. After the surrounding cutting, take the pry chip to remove the CPU
6. Place the disassembled CPU aside for the next step
7. Adjust the temperature to 180 ° C and scrape the CPU slot
8. Remove the motherboard, replace the CPU, adjust to 180 ° C, then scraping
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