Luowei HS3 Uniform Preheat Platform for Mobile Phone Motherboard Chip BGA Repair
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Seller: Worldswa Shenzhen
ID: MV-25082334LML4
Weight: 0.35 kg
| Qty | Price | Discount |
|---|---|---|
| 1 | NaN | |
| 3 | NaN | -3.1% |
| 5 | NaN | -4.6% |
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Product details
Description
Luowei HS3 Uniform Preheat Platform for Mobile Phone Motherboard Chip BGA Repair
Features:
- Uniform heating, no hot air gun required, no soldering iron required
- Aerospace aluminum alloy plate, efficient heating coverage, reduces energy consumption, broad application range
- Compact and portable, compact size, powerful performance precise temperature control
- Maximum power 99W, PD power delivery, more rapid heating
- Light interactivity, simple operation, and color changes reflect the device's status
- preheat platform, tinning, degumming, laminating, temperature control, vibrant light interaction, safe and constant temperature
- Infinite control knob, simple operation, one-touch adjustment
- The heating area eliminates excess and enhances efficiency and precise heating, 65mm×100mm fits various sizes of smartphone motherboards
Package includes:
- 1 x Platform
- 1 x Cable
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