MaAnt 0.12mm Huawei Mobile Phones BGA Reballing Stencils Middle Layer
0 out of 5 stars
No review yet| Qty | Price | Discount |
|---|---|---|
| 1 | NaN | |
| 3 | NaN | -2.9% |
| 5 | NaN | -5.0% |
| 10 | NaN | -8.6% |
Please select Type
Choose a Type
for V30 Pro
for Honor 30 Pro
for Mate30 5G
for Mate30 Pro 4G
for Mate30Pro 4G
for Mate40 Pro
for Mate40 RS Porsche
for Mate RS Porsche
Nova6 5G/V30 5G
for P30 Pro
for P40 Pro
for P40 Pro+
for P50 Pro
for Magic 3
for Magic 3 Pro
Magic 3 Pro CameraFull Set/16PcsProduct details
Description
MaAnt 0.12mm Middle Layer BGA Reballing Stencils for Huawei Mobile Phones
Product Description:
This high-quality BGA reballing stencil is designed specifically for Huawei mobile phones, ensuring precise and accurate reballing results.
Key Features:
- Accurate Design:** Each mesh is checked according to the original drawing to ensure that each solder joint is perfectly aligned.
- Flexibility and Durability:** Keep the flexibility of steel for a long time, with normal deformation and bending, it's easy to restore it immediately.
- High-Temperature Resistance:** Imported alloy steel with good high-temperature resistance and metal fatigue resistance, making the service life of the product more lasting.
- Improved Solder Ball Formation:** Square hole chamfered tin planting black net makes every tin ball of you, more round and full, no solder ball.
- Enhanced Toughness:** It has higher toughness and high-temperature resistance than ordinary steel.
Package Includes:
- 1 x Stencil
Customer reviews
0.0/ 5.0
0
0
0
0
0
