MaAnt 0.12mm Huawei Mobile Phones BGA Reballing Stencils Middle Layer
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Seller: Worldswa Shenzhen
ID: MV-23020895V92K
Weight: 0.01 kg
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Description
MaAnt 0.12mm Middle Layer BGA Reballing Stencils for Huawei Mobile Phones
Product Description:
This high-quality BGA reballing stencil is designed specifically for Huawei mobile phones, ensuring precise and accurate reballing results.
Key Features:
- Accurate Design:** Each mesh is checked according to the original drawing to ensure that each solder joint is perfectly aligned.
- Flexibility and Durability:** Keep the flexibility of steel for a long time, with normal deformation and bending, it's easy to restore it immediately.
- High-Temperature Resistance:** Imported alloy steel with good high-temperature resistance and metal fatigue resistance, making the service life of the product more lasting.
- Improved Solder Ball Formation:** Square hole chamfered tin planting black net makes every tin ball of you, more round and full, no solder ball.
- Enhanced Toughness:** It has higher toughness and high-temperature resistance than ordinary steel.
Package Includes:
- 1 x Stencil
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