MaAnt 0.12mm Screen IC / Face / Tail Board / Infrared / True Color / Camera BGA Reballing Stencil for iPhone 6S-15Pro Max

MaAnt 0.12mm Screen IC / Face / Tail Board / Infrared / True Color / Camera BGA Reballing Stencil for iPhone 6S to 15Pro Max

Product Highlights

This premium reballing stencil is designed for iPhone 6S to 15Pro Max, offering a superior solution for BGA reballing with its advanced features:

Features:

• Durable and Flexible**: Keep the flexibility of steel for a long time, with normal deformation and bending, and easy to restore immediately.
• High-Temperature Resistance**: Imported alloy steel with good high-temperature resistance and metal fatigue resistance, making the service life of the product more lasting.
• Full and Round Tin Balls**: The tin ball is full and round, square hole chamfered tin planting black net makes every tin ball of you more round and full.
• Strong Toughness**: Selected steel has strong toughness and is not easy to deform at high temperature.
• Accurate Alignment**: Accurate alignment, good flexibility, durability, and high-temperature resistance, give you a different tin planting experience.
• Precise Mesh Design**: Accurate alignment, each mesh is checked according to the original drawing to ensure that there should be no fewer solder joints, which are completely consistent and accurately aligned.
• Square Hole Fillet Design**: Square hole fillet design, high precision, burr-free, so that every mesh can the same size does not jam tin.

**Summary:** This stencil offers a perfect combination of durability, flexibility, and high-temperature resistance, ensuring a long-lasting and accurate BGA reballing experience.