MaAnt 1.5M Low Residue No-clean Solder Wick for BGA Desoldering of Phone PCB

MaAnt 1.5M Low Residue No-clean Solder Wick for Phone PCB BGA Desoldering

Features:

• Fast tinning, low residue, oxidation resistance, no breakpoint, good effect, corrosion resistance
  Refined from pure copper and special chemical formula, to ensure fast, good and economical, it is used to absorb excess solder when removing tin, anti-oxidation and anti-corrosion, good thermal conductivity and tin absorption, and clean tin absorption.
• The tin suction wire should be used when the pins of the soldering components are connected with tin, which can absorb the tin adhered to the pins and ensure that there is no short circuit between the pins.
• When re-balling BGA components, use tin-absorbing wire to clean the pads, which greatly increases the success rate of re-balling.
• Scope of application: suitable for cleaning PCB boards and other solders.

How to use:

• For the solder you want to remove, place the appropriate length of solder wire on the reflow point to be cleaned.
• Then use the electric iron welding nozzle to lightly press and heat, and after the solder melts, it will be absorbed by the tin suction wire.
• Once the solder has been picked up, remove both the soldering iron and the suction wire.
• The used desoldering wire, please cut it off with pliers.

Package includes:

• 1 x Solder Wick

Summary of Features:

• Fast and efficient solder removal
• Low residue and no breakpoint
• Good thermal conductivity and tin absorption
• Corrosion resistance and anti-oxidation
• Wide range of applications, including PCB boards and BGA components