MaAnt Qualcomm Snapdragon 888 SM8350 Anti-Short Circuit Isolation BGA Reballing Stencil
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Product details
Description
MaAnt Anti-Short Circuit Isolation BGA Reballing Stencil for Qualcomm Snapdragon 888 SM8350
Important Notice: This product requires a Magnetic Motive C1 tin planting table to function properly. If you don't have one, please Click Here to purchase one.
What's Included:
- 1 x Stencil
Features:
- Anti-Short Circuit Isolation: Ensures safe and reliable reballing process.
- BGA Reballing Stencil: Specifically designed for Qualcomm Snapdragon 888 SM8350.
- Compatibility: Requires Magnetic Motive C1 tin planting table for proper use.
Summary:
- High-quality stencil for reballing Qualcomm Snapdragon 888 SM8350.
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