MaAnt 0.12mm High-quality Chip Qualcomm CPU Full-chip Series BGA Reballing Stencil
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Seller: Worldswa Shenzhen
ID: MV-211023PUR251
Weight: 0.01 kg
| Qty | Price | Discount |
|---|---|---|
| 1 | NaN | |
| 3 | NaN | -2.9% |
| 5 | NaN | -5.0% |
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Qualcomm CPU-1
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One Set/8PCSProduct details
Description
MaAnt 0.12mm High-quality Chip Qualcomm CPU Full-chip Series BGA Reballing Stencil
Package includes:
- 1 x BGA Reballing Stencil
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