MaAnt Magnetic Power C1 Absorption Positioning Tin Planting Platform Set for Apple, HiSilicon, Qualcomm Snapdragon Series CPU
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Seller: Worldswa Shenzhen
ID: MV-220412Y76B76
Weight: 1.50 kg
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| 3 | NaN | -3.1% |
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Base + Full Set Stencil/61Pcs
for EMMC RAM BGA Stencil Set/7Pcs
for MediaTek Stencil Set/10Pcs
for HiSilicon Qualcomm RAM Stencil Set/7Pcs
for Apple A8-A17 Stencil Set/10Pcs
for HiSilicon Stencil Set/9Pcs
for Snapdragon Stencil Set/11Pcs
only C1 Base
for Samsung Stencil Set/7PcsProduct details
Description
MaAnt Magnetic Power C1 Absorption Positioning Tin Planting Platform Set for Apple/HiSilicon/Qualcomm Snapdragon Series CPU
Product Features:
- **Automatic Precise Positioning**: Ensures accurate and efficient chip placement.
- **New Magnetic Dynamic Original Positioning**: Innovative technology for secure chip alignment.
- **Strong Magnetic Force Automatic Clamping**: Holds the chip in place with ease.
Easy Installation Method:
- Prepare the tin planting platform and close the chip with a small triangle, fixed on the clamping position (It shall be consistent with the direction of the steel mesh).
- Place the steel mesh directly on the slot of the magnetic suction base to complete the installation (Check whether the mesh is aligned with the bottom chip).
What's in the Box:
- 1 x Tin planting platform set
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