MaAnt Qualcomm CPU Comprehensive BGA Reballing Stencil for Snapdragon CPU Models
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Qualcomm CPU-A
Qualcomm CPU-B
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Description
MaAnt Qualcomm CPU Comprehensive BGA Reballing Stencil for Most Qualcomm Snapdragon CPU
Compatibility:
This comprehensive BGA reballing stencil is compatible with a wide range of Qualcomm Snapdragon CPUs, including:
- Qualcomm CPU-A: SM8450, SM8350, SM7325, SM8150, SM8250, SM8250-002, SM7250, SM7350
- Qualcomm CPU-B: SM7225, SM7125, SM7150, SM6225, SM6125, SM6115, SDM845, SM4250
- Qualcomm CPU-C: SDM710, SM6150, MSM8909, SDM439, SDM660, SDM670, MSM8917, MSM8940
- Android CPU Stage-A: SM8350, SDM845, HI36A0, MSM8996, MSM8998, Hi3670, 80, 90, HIi6260, Hi3650, MSM8956, Hi3630, 35
What's Included:
This package includes:
- 1 x Stencil
Summary: This comprehensive BGA reballing stencil is designed for most Qualcomm Snapdragon CPUs, making it an essential tool for repair and maintenance professionals.
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