MaAnt SL-1 Deicing by Magic Furnace: IC Chip Heating for De-gumming & De-tinning

MaAnt SL-1 Deicing by Magic Furnace for IC Chip Heating De-gumming and De-tinning

Product Description:

The MaAnt SL-1 Deicing is a professional IC chip heating tool designed for de-gumming and de-tinning. With its advanced features, it supports multi-generation Apple and Huawei chip glue removal, tin removal work, and is applicable to 99% of the chips on the market.

Key Features:

• One-Button Heating: Rapid heating with adjustable temperature between 160-250°C, ensuring safe and efficient chip de-gumming and de-tinning.
• Universal Compatibility: Supports multiple generations Apple mobile phone chip, Huawei mobile phone chip, universal hard disk, and CPU glue detinning.
• Temperature Control: **Avoid Burn-out Chip**, temperature can be adjusted between 160℃ and 250℃ to prevent damage.
• Easy De-gumming: Use a brush or cotton ball and cotton swab to remove residual tin after heating to the set temperature.
• Tin Removal Made Easy: No tin line, a wipe can easily remove tin and glue, and easy and quick tin planting.
• Safety Features:
  • Air gun heating is safer than 100 degrees lower than air gun temperature scraping.
  • No soldering iron heating without repeated scraping of a soldering iron, no damage to the pad.
• Fast and Safe Heating: **No Leakage, No Static Electricity**, safer curve heating with built-in professional adjustment curve.
• Convenient Temperature Adjustment: Set the temperature according to the job requirements, one-click heat up quickly, no need to worry about temperature over the damaged chip.
• Hidden Screw Design: Flexible and light, flexible telescopic clamping, hidden screw prevents residue from falling into the screw, more durable and useful.
• Fast Charger Support: Work anywhere, anytime with fast charger support for heating work.

Package Includes:

• 1 x Heating Platform