Maples PPD 120XL Mini Intelligent Heater Rework Station for iPhone X Logic Board - Desoldering, Demolition, Welding & Remove Platform

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Description
**Introducing the Maples PPD 120XL Heater Mini Intelligent Remove Welding Platform**
This professional tool is designed for efficient and fast repair of iPhone X logic boards, eliminating the need for a hot air rework station. It operates at a maximum temperature of 230℃, making it an ideal solution for dismantling and reworking iPhone X upper and lower logic boards, CPU, and NAND IC.
**Temperature Setting Parameters:**
Demolition shield temperature adjustment: 180℃-220℃
In addition to CPU side glue temperature: 180℃-220℃
Demolition A11 CPU temperature: 230℃-240℃
Desmearing temperature: 180℃-200℃
Reball BGA chip temperature: 180℃-200℃
Soldering A11 CPU temperature: 190℃-210℃
**What's in the Box:**
**Summary:** A comprehensive package for iPhone X logic board repair, including:
1 x Maples PPD 120XL Mini Intelligent Remove Welding Platform






