Martview RB-03 Universal BGA ICs Reballing Stencil Net, 0.76MM P:1.27 Spacing Solder Balls

0 out of 5 stars
No review yetQty | Price | Discount |
---|---|---|
1 | NaN | |
3 | NaN | -4.8% |
5 | NaN | -10.1% |
10 | NaN | -20.6% |
Product details
Description
Martview RB-03 0.76MM P:1.27 Spacing Solder Balls Universal BGA ICs Reballing Stencil Net
**Related Product:** Martview RB-03 Multi-functions Automatic Positioning Universal BGA Reballing Station Holder Template
Features:
- **Round Hole Design**, stencil net thickness: 0.2mm, high precision, burr-free, so that every mesh can the same size does not jam tin
- **High-Quality Material**: Imported alloy steel, high material, and technology, dirt-resistant, easy to clean
- **Flexible and Rigid Stencil**: Maintaining the flexibility of the steel, normal deformation and bending can be easily restored to its original shape
- **High Precision**: No burrs, so that every mesh can be of the same size and not stuck
- **Heat Resistance**: Selected steel has strong toughness and is not easy to deform at high temperature
- **Accurate Alignment**: Good flexibility, durability, and high-temperature resistance, give you a different tin planting experience
- **Precise Mesh**: Accurate alignment, each mesh is checked according to the original drawing to ensure that there should be no fewer solder joints, which are completely consistent and accurately aligned
Package includes:
- 1 x Stencil

Customer reviews
0.0/ 5.0
0
0
0
0
0