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Martview RB-03 BGA Reballing Stencil Set for iPhone & Qualcomm / MTK / Hisilicon / Exynos / EMMC BGA

iphone qualcomm--hisilicon--mtk--samsung--emmc--universal-bga--solder-ball-universal-bga-95pcs-2

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IP A8-A17 CPU 10pcs Stencil OnlyIP A8-A17 CPU 10pcs Stencil OnlyQualcomm Snapdragon 21pcs Stencil OnlyQualcomm Snapdragon 21pcs Stencil OnlyHisilicon Kirin 18pcs Stencil OnlyHisilicon Kirin 18pcs Stencil OnlyMTK Dimensity 10pcs Stencil OnlyMTK Dimensity 10pcs Stencil OnlySamsung Exynos 10pcs Stencil OnlySamsung Exynos 10pcs Stencil OnlyEMMC UFS 7pcs Stencil OnlyEMMC UFS 7pcs Stencil OnlyUniversal BGA 7pcs Stencil OnlyUniversal BGA 7pcs Stencil OnlySolder Ball Universal BGA 12pcs Stencil OnlySolder Ball Universal BGA 12pcs Stencil OnlyQC+HI+MT+EX 59pcs StencilQC+HI+MT+EX 59pcs StencilQC+HI+MT+EX+EMMC 66pcs StencilQC+HI+MT+EX+EMMC 66pcs StencilQC+HI+MT+EX+EMMC+UN 73pcs StencilQC+HI+MT+EX+EMMC+UN 73pcs StencilIP+QC+HI+MT+EX+EMMC 76pcs StencilIP+QC+HI+MT+EX+EMMC 76pcs StencilIP+QC+HI+MT+EX+EMMC+UN 83pcs StencilIP+QC+HI+MT+EX+EMMC+UN 83pcs StencilFull Set 95pcs StencilFull Set 95pcs Stencil

Product details

Description

Martview RB-03 BGA Reballing Stencil Set for iPhone / Qualcomm / MTK / Hisilicon / Exynos / EMMC BGA
Click Here to order Martview RB-03 Multi-functions Automatic Positioning Universal BGA Reballing Station Holder Template


Features:
  • Imported alloy steel, high material, and technology, dirt-resistant, easy to clean
  • Rigid and flexible stencil, maintaining the flexibility of the steel, normal deformation and bending can be easily restored to its original shape
  • High precision, no burrs, so that every mesh can be of the same size and not stuck
  • Selected steel has strong toughness and is not easy to deform at high temperature
  • Accurate alignment, good flexibility, durability, and high-temperature resistance, give you a different tin planting experience
  • Accurate alignment, each mesh is checked according to the original drawing to ensure that there should be no fewer solder joints, which are completely consistent and accurately aligned
  • Square hole fillet design, high precision, burr-free, so that every mesh can the same size does not jam tin


Stencil Specification:

**IP A8-A17 CPU 10pcs Stencil Features:**

  • Support A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 CPU RAM (iPhone 6/6 plus, iPhone 6S/6s plus, iPhone 7/7 plus, iPhone 8/8 plus, iPhone X/XS/XS Max/XR, iPhone 11/11Pro/11Pro Max, iPhone 12 mini/12/12 Pro/12 Pro Max, iPhone 13 mini/13/13 Pro/13 Pro Max, iPhone 14/14 Plus/14 Pro/14 Pro Max, iPhone 15/15 Plus/15 Pro/15 Pro Max)
  • Size: 65.4mm x 65.4mm
  • Stencil net thickness: 0.12mm
  • Square holes and rounded corners


**For Qualcomm Snapdragon Series CPU (21pcs) Support Model:** New!

  • RB03-QT 1 For Qualcomm Snapdragon 210 MSM8909
  • RB03-QT 2 For Qualcomm Snapdragon 410 MSM8916,615 MSM8939
  • RB03-QT 3 For Qualcomm Snapdragon 425 MSM8917
  • RB03-QT 4 For Qualcomm Snapdragon 430 MSM8937, 435 MSM8940
  • RB03-QT 5 For Qualcomm Snapdragon 460 SM4250, 662 SM6115
  • RB03-QT 6 For Qualcomm Snapdragon 625 MSM8953 1AB
  • RB03-QT 7 For Qualcomm Snapdragon SDM450/632 MSM8953 B01
  • RB03-QT 8 For Qualcomm Snapdragon 636 SDM636, 660 SDM660
  • RB03-QT 9 For Qualcomm Snapdragon 765G SM7250
  • RB03-QT 10 For Qualcomm Snapdragon 778G SM7315/7325
  • RB03-QT 11 For Qualcomm Snapdragon 820 MSM8996
  • RB03-QT 12 For Qualcomm Snapdragon 835 MSM8998
  • RB03-QT 13 For Qualcomm Snapdragon 845 SMD845
  • RB03-QT 14 For Qualcomm Snapdragon 855 SM8150
  • RB03-QT 15 For Qualcomm Snapdragon 865/870 SM8250-002 Big
  • RB03-QT 16 For Qualcomm Snapdragon 865 SM8250-102 Smal
  • RB03-QT 17 For Qualcomm Snapdragon 888 SM8350
  • RB03-QT 18 For Qualcomm Snapdragon 888 SM8350 Anti-short Circuit Net
  • RB03-QT 19 For Qualcomm Snapdragon 8Gen1 SM8450
  • RB03-QT 20 For Qualcomm Snapdragon 8Gen2 SM8550
  • RB03-QT 21 For Qualcomm Snapdragon 7+Gen2 SM7475, 8+Gen1 SM8475/8425
  • Size: 65.4mm x 65.4mm
  • Stencil net thickness: 0.12mm
  • Square holes and rounded corners


**For Hisilicon Kirin Series CPU (18pcs) Support Model:** New!

  • RB03-HI 1 For Hisilicon Kirin 620 HI6220
  • RB03-HI 2 For Hisilicon Kirin 659 HI6250
  • RB03-HI 3 For Hisilicon Kirin 710 HI6260 V100
  • RB03-HI 4 For Hisilicon Kirin 710 HI6260 V101
  • RB03-HI 5 For Hisilicon Kirin 810 HI6280
  • RB03-HI 6 For Hisilicon Kirin 820/985 HI6290/L
  • RB03-HI 7 For Hisilicon Kirin 960 HI3660
  • RB03-HI 8 For Hisilicon Kirin 970 HI3670
  • RB03-HI 9 For Hisilicon Kirin 980 HI3680
  • RB03-HI 10 For Hisilicon Kirin 990 HI3690 5G
  • RB03-HI 11 For Hisilicon Kirin HI9500 V100
  • RB03-HI 12 For Hisilicon Kirin 9000 HI36A0
  • RB03-HI 13 For Hisilicon Kirin 9000S HI36A0-V120
  • RB03-HI 14 For Hisilicon HI6260 RAM
  • RB03-HI 15 For Hisilicon HI3660 RAM
  • RB03-HI 16 For Hisilicon HI3670/80/90 RAM
  • RB03-HI 17 For Hisilicon HI36A0 RAM
  • RB03-HI 18 For Hisilicon Kirin 990 HI3690 4G
  • Size: 65.4mm x 65.4mm
  • Stencil net thickness: 0.12mm
  • Square holes and rounded corners


**For MTK Dimensity Series CPU (10pcs) Support Model:** New!

  • RB03-MT 1 For MTK Dimensity MT6768V/6769V
  • RB03-MT 2 For MTK Dimensity 700/810 MT6833V
  • RB03-MT 3 For MTK Dimensity 720 MT6853V
  • RB03-MT 4 For MTK Dimensity 800 MT6873V, 820 MT6875V
  • RB03-MT 5 For MTK Dimensity 900/1080 MT6877V
  • RB03-MT 6 For MTK Dimensity 1000 MT6889Z, 1000L MT6885Z
  • RB03-MT 7 For MTK Dimensity 1100 MT6891Z, 1200 MT6893Z
  • RB03-MT 8 For MTK Dimensity 8100 MT6895Z
  • RB03-MT 9 For MTK Dimensity 9000 MT6983Z
  • RB03-MT 10 For MTK Dimensity 9200 MT6985W
  • Size: 65.4mm x 65.4mm
  • Stencil net thickness: 0.12mm
  • Square holes and rounded corners


**For Samsung Exynos Series CPU (10pcs) Support Model:** New!

  • RB03-EX 1 For Samsung Exynos Exynos 2100
  • RB03-EX 2 For Samsung Exynos Exynos 2200/E9925
  • RB03-EX 3 For Samsung Exynos Exynos 7884/7885/7904
  • RB03-EX 4 For Samsung Exynos Exynos 880/980
  • RB03-EX 5 For Samsung Exynos Exynos 8895
  • RB03-EX 6 For Samsung Exynos Exynos 9609
  • RB03-EX 7 For Samsung Exynos Exynos 9610/9611
  • RB03-EX 8 For Samsung Exynos Exynos 9815/1080
  • RB03-EX 9 For Samsung Exynos Exynos 9820
  • RB03-EX 10 For Samsung Exynos Exynos 990
  • Size: 65.4mm x 65.4mm
  • Stencil net thickness: 0.12mm
  • Square holes and rounded corners

**EMMC UFS 7pcs Stencil Features:**

  • Support for EMMC EMCP UFS BGA153 BGA162 BGA169 BGA186 BGA221 BGA254 BGA297 all size
  • Size: 65.4mm x 65.4mm
  • Stencil net thickness: 0.12mm
  • Square holes and rounded corners

**Universal BGA 7pcs Stencil Features:**

  • P:0.3 50X50: Spacing:0.3
  • P:0.35 50X50: Spacing:0.35
  • P:0.4 50X50: Spacing:0.4
  • P:0.5 50X50: Spacing:0.5
  • P:0.35 45° 50X50: Spacing:0.35
  • P:0.4 45° 50X50: Spacing:0.4
  • P:0.4 D 50X50: Spacing:0.4
  • Size: 63mm x 63mm
  • Stencil net thickness: 0.12mm
  • Square holes and rounded corners

**0.5-1.5MM Universal 12pcs Stencil Features:**

  • 0.25MM P:0.5: Solder Balls size: 0.25mm Spacing:0.5
  • 0.3MM P:0.58: Solder Balls size: 0.3mm Spacing:0.58
  • 0.35MM P:0.65: Solder Balls size: 0.35mm Spacing:0.65
  • 0.4MM P:0.7: Solder Balls size: 0.4mm Spacing:0.7
  • 0.45MM P:0.78: Solder Balls size: 0.45mm Spacing:0.78
  • 0.5MM P:0.8: Solder Balls size: 0.5mm Spacing:0.8
  • 0.55MM P:1.02: Solder Balls size: 0.55mm Spacing:1.02
  • 0.6MM P:0.9: Solder Balls size: 0.6mm Spacing:0.9
  • 0.6MM P:1.0: Solder Balls size: 0.6mm Spacing:1.0
  • 0.6MM P:1.1: Solder Balls size: 0.6mm Spacing:1.1
  • 0.76MM P:1.27: Solder Balls size: 0.76mm Spacing:1.27
  • 1.0MM P:1.5: Solder Balls size: 1.0mm Spacing:1.5
  • Size: 63mm x 63mm
  • Stencil net thickness: 0.2mm
  • Circular hole

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bga reballing-stencil

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