Martview RB03-QT1 Qualcomm Snapdragon 210 MSM8909 CPU BGA Reballing Stencil

Martview RB03-QT1 CPU BGA Reballing Stencil for Qualcomm Snapdragon 210 MSM8909

Click Here to order Martview RB-03 Multi-functions Automatic Positioning Universal BGA Reballing Station Holder Template

Features:

• **High-quality material**: Imported alloy steel, high material, and technology, dirt-resistant, easy to clean
• **Flexible and rigid stencil**: Maintaining the flexibility of the steel, normal deformation and bending can be easily restored to its original shape
• **High precision**: No burrs, so that every mesh can be of the same size and not stuck
• **Strong toughness**: Selected steel has strong toughness and is not easy to deform at high temperature
• **Accurate alignment and durability**: Good flexibility, durability, and high-temperature resistance, give you a different tin planting experience
• **Precise mesh alignment**: Accurate alignment, each mesh is checked according to the original drawing to ensure that there should be no fewer solder joints, which are completely consistent and accurately aligned
• **Square hole fillet design**: High precision, burr-free, so that every mesh can the same size does not jam tin
• **Size and net thickness**: 65.4mm x 65.4mm, stencil net thickness: 0.12mm
• **Design features**: Square holes and rounded corners

Package includes:

• 1 x Stencil