Martview RB03-QT3 Qualcomm Snapdragon 425 MSM8917 CPU BGA Reballing Stencil
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Product details
Description
Martview RB03-QT3 CPU BGA Reballing Stencil for Qualcomm Snapdragon 425 MSM8917
Click Here to order Martview RB-03 Multi-functions Automatic Positioning Universal BGA Reballing Station Holder Template
Features:
- Imported alloy steel, high material, and technology, dirt-resistant, easy to clean
- Rigid and flexible stencil, maintaining the flexibility of the steel, normal deformation and bending can be easily restored to its original shape
- High precision, no burrs, so that every mesh can be of the same size and not stuck
- Selected steel has strong toughness and is not easy to deform at high temperature
- Accurate alignment, good flexibility, durability, and high-temperature resistance, give you a different tin planting experience
- Accurate alignment, each mesh is checked according to the original drawing to ensure that there should be no fewer solder joints, which are completely consistent and accurately aligned
- Square hole fillet design, high precision, burr-free, so that every mesh can the same size does not jam tin
- Size: 65.4mm x 65.4mm
- Stencil net thickness: 0.12mm
- Square holes and rounded corners
**Summary:** High-quality stencil with accurate alignment, good flexibility, and durability, perfect for BGA reballing.
- 1 x Stencil
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