Martview RB03-HI1 CPU BGA Reballing Stencil: Huawei Hisilicon 620 HI6220 Compatible

Martview RB03-HI1 CPU BGA Reballing Stencil for Huawei Hisilicon 620 HI6220

Click Here to order Martview RB-03 Multi-functions Automatic Positioning Universal BGA Reballing Station Holder Template

Features:

• **High-Quality Material**: Imported alloy steel, high material, and technology, dirt-resistant, easy to clean
• **Flexible and Rigid Stencil**: Maintaining the flexibility of the steel, normal deformation and bending can be easily restored to its original shape
• **High Precision**: No burrs, so that every mesh can be of the same size and not stuck
• **Strong and Durable**: Selected steel has strong toughness and is not easy to deform at high temperature
• **Accurate Alignment**: Good flexibility, durability, and high-temperature resistance, give you a different tin planting experience
• **Precise Mesh Alignment**: Each mesh is checked according to the original drawing to ensure that there should be no fewer solder joints, which are completely consistent and accurately aligned
• **Square Hole Fillet Design**: High precision, burr-free, so that every mesh can the same size does not jam tin
• **Dimensions**: Size: 65.4mm x 65.4mm, Stencil net thickness: 0.12mm
• **Design Features**: Square holes and rounded corners

Package includes:

• 1 x Stencil