Martview RB03-HI12: CPU BGA Reballing Stencil for Huawei Hisilicon HI36A0 9000

Martview RB03-HI12 CPU BGA Reballing Stencil for Huawei Hisilicon 9000 HI36A0

Click Here to order Martview RB-03 Multi-functions Automatic Positioning Universal BGA Reballing Station Holder Template

Features:

• **High-quality material**: Imported alloy steel, high material, and technology, dirt-resistant, easy to clean
• **Flexible and rigid stencil**: Maintaining the flexibility of the steel, normal deformation and bending can be easily restored to its original shape
• **High precision**: No burrs, so that every mesh can be of the same size and not stuck
• **Strong and durable**: Selected steel has strong toughness and is not easy to deform at high temperature
• **Accurate alignment**: Good flexibility, durability, and high-temperature resistance, give you a different tin planting experience
• **Precise mesh design**: Accurate alignment, each mesh is checked according to the original drawing to ensure that there should be no fewer solder joints, which are completely consistent and accurately aligned
• **Burr-free design**: Square hole fillet design, high precision, burr-free, so that every mesh can the same size does not jam tin
• **Dimensions**: Size: 65.4mm x 65.4mm, Stencil net thickness: 0.12mm
• **Design features**: Square holes and rounded corners

Package includes:

• 1 x Stencil