Martview RB03-HI16 CPU BGA Reballing Stencil for Huawei Hisilicon HI3670 / HI3680 / HI3690 RAM

Martview RB03-HI16 CPU BGA Reballing Stencil for Huawei Hisilicon HI3670 / HI3680 / HI3690 RAM

Click Here to order Martview RB-03 Multi-functions Automatic Positioning Universal BGA Reballing Station Holder Template

Features:

• **High-Quality Material**: Imported alloy steel, high material, and technology, dirt-resistant, easy to clean
• **Flexible and Rigid Design**: Rigid and flexible stencil, maintaining the flexibility of the steel, normal deformation and bending can be easily restored to its original shape
• **High Precision**: High precision, no burrs, so that every mesh can be of the same size and not stuck
• **Heat Resistant**: Selected steel has strong toughness and is not easy to deform at high temperature
• **Accurate Alignment**: Accurate alignment, good flexibility, durability, and high-temperature resistance, give you a different tin planting experience
• **Precise Mesh Design**: Accurate alignment, each mesh is checked according to the original drawing to ensure that there should be no fewer solder joints, which are completely consistent and accurately aligned
• **Square Hole Fillet Design**: Square hole fillet design, high precision, burr-free, so that every mesh can the same size does not jam tin
• **Product Specifications**: Size: 65.4mm x 65.4mm, Stencil net thickness: 0.12mm, Square holes and rounded corners

Package Includes:

• 1 x Stencil