Martview RB03-HI4: CPU BGA Reballing Stencil for Huawei Hisilicon HI6260 V101 710
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Product details
Description
Martview RB03-HI4 CPU BGA Reballing Stencil for Huawei Hisilicon 710 HI6260 V101
Click Here to order Martview RB-03 Multi-functions Automatic Positioning Universal BGA Reballing Station Holder Template
Features:
Imported alloy steel, high material, and technology, dirt-resistant, easy to clean
Rigid and flexible stencil, maintaining the flexibility of the steel, normal deformation and bending can be easily restored to its original shape
High precision, no burrs, so that every mesh can be of the same size and not stuck
Selected steel has strong toughness and is not easy to deform at high temperature
Accurate alignment, good flexibility, durability, and high-temperature resistance, give you a different tin planting experience
Accurate alignment, each mesh is checked according to the original drawing to ensure that there should be no fewer solder joints, which are completely consistent and accurately aligned
Square hole fillet design, high precision, burr-free, so that every mesh can the same size does not jam tin
Size: 65.4mm x 65.4mm
Stencil net thickness: 0.12mm
Square holes and rounded corners
Summary:** High-quality stencil with accurate alignment, good flexibility, and durability, ideal for BGA reballing.
Package includes:
1 x Stencil
