Martview RB03-HI6: Huawei Hisilicon 820 HI6290 / 985 HI6290L CPU BGA Reballing Stencil
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Product details
Description
Martview RB03-HI6 CPU BGA Reballing Stencil for Huawei Hisilicon 820 HI6290 / 985 HI6290L
Click Here to order Martview RB-03 Multi-functions Automatic Positioning Universal BGA Reballing Station Holder Template
Features:
High-quality Material: Imported alloy steel, high material, and technology, dirt-resistant, easy to clean
Flexible and Rigid Stencil: Maintaining the flexibility of the steel, normal deformation and bending can be easily restored to its original shape
High Precision: No burrs, so that every mesh can be of the same size and not stuck
Strong Toughness: Selected steel has strong toughness and is not easy to deform at high temperature
Accurate Alignment: Good flexibility, durability, and high-temperature resistance, give you a different tin planting experience
Precise Mesh: Accurate alignment, each mesh is checked according to the original drawing to ensure that there should be no fewer solder joints, which are completely consistent and accurately aligned
Square Hole Fillet Design: High precision, burr-free, so that every mesh can the same size does not jam tin
Specifications: Size: 65.4mm x 65.4mm, Stencil net thickness: 0.12mm, Square holes and rounded corners
**Summary:** High-quality BGA reballing stencil with imported alloy steel, high precision, and accurate alignment for Huawei Hisilicon 820 HI6290 / 985 HI6290L.
Package includes:
1 x Stencil
