Martview RB03-HI7: Huawei Hisilicon 960 HI3660 CPU BGA Reballing Stencil
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Product details
Description
Martview RB03-HI7 CPU BGA Reballing Stencil for Huawei Hisilicon 960 HI3660
Click Here to order Martview RB-03 Multi-functions Automatic Positioning Universal BGA Reballing Station Holder Template
Features:
- **High-Quality Material**: Imported alloy steel, high material, and technology, dirt-resistant, easy to clean
- **Flexible and Rigid Stencil**: Maintaining the flexibility of the steel, normal deformation and bending can be easily restored to its original shape
- **High Precision**: No burrs, so that every mesh can be of the same size and not stuck
- **Strong Toughness**: Selected steel has strong toughness and is not easy to deform at high temperature
- **Accurate Alignment**: Good flexibility, durability, and high-temperature resistance, give you a different tin planting experience
- **Precision Alignment**: Each mesh is checked according to the original drawing to ensure that there should be no fewer solder joints, which are completely consistent and accurately aligned
- **Square Hole Fillet Design**: High precision, burr-free, so that every mesh can the same size does not jam tin
- **Specifications**: Size: 65.4mm x 65.4mm, Stencil net thickness: 0.12mm, Square holes and rounded corners
Package includes:
- 1 x Stencil
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